Civen Hlau Khoom (Shanghai) Co., Ltd. yog ib qho ntawm cov ua lag luam thiab cov neeg muag khoom ntawm hte siab elongation ed tooj liab ntawv ci hauv Suav teb. Txais tos kom yuav cov khoom ruaj khov hte siab elongation ed tooj liab ntawv ci ua nyob rau hauv Suav teb nov los ntawm peb lub hoobkas. Yog tias koj muaj lus nug txog kev koom tes, thov koj xav email rau peb.
HTE Electrolytic Copper Foil rau PCB Lamination
HTE siab elongation ED tooj liab ntawv ci yog ib qho electrolytic tooj liab ntawv ci tsim rau cov ntawv luam tawm Circuit Board daim ntawv thov uas yuav tsum tau tsim elongation, thermal oxidation tsis kam thiab kev sib txuas ua haujlwm thaum lub sij hawm lamination. Nws yog ib qho -sab- roughened nto yog tsim los txhawb adhesion rau resin- cov ntaub ntawv raws li, thaum cov ntawv ci cov khoom siv thiab cov khoom nto pab txiav txim siab nws qhov tsim nyog rau kev xaiv PCB.
CIVEN Hlau teev cov khoom no rau ob -sab thiab multilayer luam tawm Circuit boards siv cov tshuab sib txawv. Kev xaiv yuav tsum coj mus rau hauv tus account lub nominal tooj liab thickness, elongation yuav tsum, nto profile, tev lub zog thiab thermal tej yam kev mob koom nyob rau hauv board fabrication.
Thickness thiab dav Specifications
HTE ED tooj liab ntawv ci yog teev nyob rau hauv nominal thicknesses los ntawm 9 μm mus rau 70 μm, sib xws rau 1/4 oz mus txog 2 oz nyob rau hauv cov khoom specifications. Qhov dav dav yog 550-1295 mm.
Qhov tsim nyog tuab yog nyob ntawm PCB tsim thiab txheej txheem tsim khoom. Kev xaiv dav yuav tsum suav nrog cov neeg siv khoom tsim khoom, cov khoom siv tuav thiab txhua qhov xav tau ua ntej siv.
Mechanical Properties thiab Surface Characteristics
Cov khoom siv cov ntaub ntawv muaj xws li tensile lub zog thiab elongation ntsuas ntawm chav tsev kub thiab siab kub, nrog rau nto roughness thiab tev lub zog. Cov txiaj ntsig no muaj feem cuam tshuam thaum ntsuas cov ntawv ci tooj liab rau lamination thiab tom qab ua tiav PCB.
Elongation yog qhov tseem ceeb tshwj xeeb tshaj yog thaum ntsuas seb cov ntawv ci teb li cas rau cov neeg kho tshuab kev ntxhov siab. Peel lub zog muab cov ntaub ntawv siv rau kev ntsuas kev sib raug zoo ntawm cov ntawv ci tooj liab thiab cov txheej txheem laminate. Nto roughness tseem cuam tshuam qhov sib cuam tshuam ntawm tooj liab thiab cob, yog li cov yam ntxwv tsim nyog yuav tsum tau txiav txim siab nrog rau adhesion thiab etching cov cai.
Daim ntawv tshaj tawm kev ua tau zoo hais txog GB / T 5230-2000 thiab IPC-4562-2000. Cov neeg yuav khoom yuav tsum tau tshuaj xyuas cov txheej txheem thickness thiab cov kev sim ntsuas es tsis yog sib piv cov nqi sib cais yam tsis xav txog cov txheej txheem ntsuas thiab laminate system.
Siab -Tub kub Oxidation Resistance
CIVEN Hlau piav qhia HTE tooj liab ntawv ci uas muaj siab -kub oxidation tsis kam thiab xim zoo nyob rau hauv cov xwm txheej tau teev nyob rau hauv nws cov ntaub ntawv cov khoom. Cov kev ntsuam xyuas muaj xws li xim - hloov kev ntsuas ntawm 190℃rau ib teev thiab solder flotation ntawm 290℃.
Cov kev xeem nkag no muab cov ntsiab lus siv rau kev ntsuam xyuas cov khoom, tab sis lawv yuav tsum tsis txhob raug txhais raws li kev lav phib xaub ntawm txhua qhov kev tsim khoom. Cov txiaj ntsig tiag tuaj yeem nyob ntawm cov txheej txheem kub, lub sijhawm raug, cia, resin system thiab tom qab kho nto.
Cov ntawv thov hauv Ob -Sided thiab Multilayer PCBs
Daim ntawv teev npe rau HTE siab elongation ED tooj liab ntawv ci yog ob -sab thiab multilayer printed circuit boards siv cov tshuab sib txawv.
Rau PCB cov tuam txhab, kev xaiv cov khoom siv yuav tsum xav txog kev tsim kho vaj huam sib luag thiab cov kev cai ntawm lamination, etching thiab kev ua haujlwm tom ntej. Ua ntej qhia cov ntawv ci, sib piv cov thickness uas yuav tsum tau muaj nrog cov khoom siv kho tshuab, nto profile thiab tev lub zog cov ntaub ntawv.
Yog tias ib qhov project muaj cov cai tshwj xeeb rau qhov roughness lossis tooj liab - rau - resin bonding, cov cai yuav tsum tau hais thaum thov kev pom zoo. Qhov no yuav pab txiav txim seb HTE specification puas haum rau lub laminate npaj thiab txheej txheem ntau lawm.
Sib piv HTE nrog lwm cov ED Copper Foils
HTE yog ib qho kev xaiv nyob rau hauv CIVEN Metal's electrolytic tooj liab foil ntau yam. Ntau hom ED foil hais txog qhov sib txawv ntawm qhov sib txawv ntawm cov tuab, qhov profile nto, adhesion thiab daim ntawv thov.
Rau tej yaam num uas nto profile thiab tev lub zog yog qhov tseem ceeb xaiv yam tseem ceeb, cov neeg yuav khoom kuj tuaj yeem tshuaj xyuasTsawg Profile ED Copper Foil (VLP). Ob yam khoom yuav tsum tau muab piv nrog lawv cov ntaub ntawv kev tshaj tawm thiab cov kev xav tau ntawm kev tsim kho PCB es tsis yog xav tias ib hom tuaj yeem hloov pauv mus rau lwm qhov.
Rau kev nthuav dav dav ntawm cov khoom siv, saib CIVEN Metal'sED Copper Foilsntau.
Cov ntaub ntawv kom suav nrog hauv HTE Copper Foil Inquiry
Txhawm rau ntsuas HTE tooj liab ntawv ci rau qhov project PCB, muab cov ntaub ntawv hauv qab no thaum thov cov lus hais:
• Yuav tsum tau thickness:Nominal thickness los yog ounce hnyav.
• Xav tau qhov dav:Txheem dav lossis thov slit dav.
• Kev tsim kho PCB:Muab ob npaug rau -sib sab lossis multilayer board thiab cov txheej txheem resin cuam tshuam.
• Cov kev xav tau ntawm kev ua haujlwm:Yuav tsum tau elongation, tev lub zog, nto roughness los yog lwm yam specification txwv.
• Cov xwm txheej ua haujlwm:Muaj feem cuam tshuam lamination thiab thermal tej yam kev mob.
• Cov cai xaj xaj:Kwv yees kom muaj nuj nqis, coil xav tau thiab xa khoom xav tau.
Muab cov ntsiab lus no pab pawg kws tshaj lij thiab kev muag khoom ntsuas cov khoom tawm tsam qhov kev tsim khoom tiag tiag. Yog tias koj qhov project tshwj xeeb IPC kev faib tawm lossis kev xeem txwv, suav nrog qhov yuav tsum tau ua hauv kev nug kom nws tuaj yeem kuaj xyuas cov kev qhia tshwj xeeb tam sim no ua ntej xaj.
Cim npe nrov: HTE High elongation ed tooj liab ntawv ci, Tuam Tshoj hte high elongation ed tooj liab ntawv ci manufacturers, lwm tus neeg, Hoobkas
