Anti-Oxidation Kho RA Copper Foil

Khoom siv hauv paus:Cu-ETP (Electrolytic Tough Pitch) or Cu-DHP copper with a purity >= 99.90%.
Microstructure:Tag nrho recrystallized equiaxed grain qauv taw qhia raws cov kev taw qhia dov rau qaug zog tiv thaiv nyob rau hauv cyclic dabtsi yog khoov.
Kev kho deg:Passivated chromium-zinc lossis organic-inorganic hybrid barrier txheej (<= 15nm).
Substrate Compatibility:Direct lamination nrog polyimide (PI), polyethylene terephthalate (PET), thiab kua siv lead ua polymer (LCP) films siv acrylic, epoxy, los yog hloov silicone adhesives.

Thermal Oxidation Resistance: Withstands 180℃rau 120 feeb nyob rau hauv atmospheric tej yam kev mob uas tsis muaj discoloration, scaling, los yog tiv thaiv tiv thaiv.

Dynamic Flexural Endurance: Muaj sia nyob tshaj 150,000 MIT folding cycles ntawm 0.8mm khoov vojvoog ua ntej qaug zog fracturing.

Peel Strength stability: Maintains initial peel strength >= 0.8 N/mm ntawm tus qauv PI zaj duab xis tom qab 72 teev ntawm 85℃thiab 85% txheeb ze av noo ua ntej etching.

Etching Uniformity: Kev tswj cov kab lis kev cai ciam teb kom huv si, undercut -dawb kab ntug txhais mus rau 20um kab/chaw (L/S) geometries siv alkaline cupric chloride los yog ferric chloride etchants.

Hluav taws xob conductivity: Bulk hluav taws xob resistivity hauv qab 1.724 x 10^-8 Ohm * m (100% IACS) ntawm 20℃.

Kev Tswj Xyuas Zoo: Ua raws li ISO 9001: 2015 thiab IATF 16949 tau ntawv pov thawj zoo.

Txias Rolling: Multi-theem Z-mill passes txo siab -purity tooj liab cathodes rau lub hom phiaj ntsuas nrog tswj qhov ntsuas qhov txo qis ib zaug.

Tswj Atmosphere Annealing: Nruam strand annealing hauv hydrogen -nitrogen tiv thaiv cub kom txo tau kev ntxhov siab thiab tswj cov nplej loj.

Nto Passivation: Inline electrochemical los yog tshuaj kho mob depositing lub uniform anti- oxidation molecular txheej.

Slitting & Ntug Trimming: Precision teb shear slitting tshem tawm burrs thiab ntug waviness.

Kev soj ntsuam raws tu qauv:

Pinhole Detection: Nruam kho qhov muag scanning hla tag nrho tus tswv coil ntev.

Mechanical Testing: Tensile thiab elongation pov thawj ntawm sab nrauv thiab sab hauv lem ntawm txhua tus tswv yob.

Traceability: Laser-etched ID ntau ntawm txhua tus tswv yob txuas nrog cov khoom siv raw Mill Test Certificate (MTC).

Flexible Printed Circuit Boards (FPCs): Smartphone hinges, koob yees duab modules, thiab foldable OLED zaub interconnects.

Automotive Sensor Khawm: Nyob rau hauv - hood kis tau tus mob tswj units thiab lub kauj log moos caij nplooj ntoos hlav circuits.

5G Telecommunication Modules: High-ntau zaus kav hlau txais xov substrates yuav tsum tau txo qis qhov poob ntawm tus neeg xyuas pib ntug.

Lithium-Ion roj teeb tam sim no khaws cia: Tab welding thiab sab hauv tam sim no sau foils xav tau txee- lub neej ruaj khov ua ntej txheej txheej txheej.

Qhov ntev: Kev cai slit dav ntawm 20mm mus rau 620mm, qhov txhab ntawm 3-nti lossis 6-nti cores nrog cov txheej txheem sab nraud.

Kev kho saum npoo: Adjustable passivation film thickness tailored rau tej downstream nplaum chemistry.

Mechanical Tempers: Customizable tensile thiab elongation profiles (Mos, Ib nrab-Hard, Full-Hard) matched rau stamping, dabtsi yog khoov, los yog etching kab.

Ntim: Nqus - kaw los tiv thaiv - static nitrogen- purged configurations.

Ntim Ntim: Ncua tseg rau hauv cov dej noo-barrier aluminium foil hnab uas muaj silica gel desiccant nyob rau hauv ib qho chaw nitrogen.

Cushioning: Ncua ntoo crates nrog hnyav -lub luag haujlwm ua npuas ncauj kom tshem tawm cov tub ntxhais crushing thiab ntug kev puas tsuaj.

Cov ntaub ntawv: suav nrog Cov Ntaub Ntawv Kev Nyab Xeeb Cov Ntaub Ntawv (MSDS), Daim Ntawv Pov Thawj Kev Ntsuam Xyuas (CoA), thiab RoHS / REACH cov ntaub ntawv ua raws.

Vertical Integration: Nyob rau hauv -lub tsev tswj ntawm dov, annealing, passivation, thiab precision slitting kom ntseeg tau batch - mus rau -batch sib xws.

Tswj Metallurgy: Kev xa ncaj qha ntawm siab -purity cathode tooj liab kom tshem tawm cov khoom siv hauv microscopic uas cuam tshuam cov tshuaj etching.

Txheej Txheem Stability: Automated inline xyuas ntawm anti- oxidation txheej thickness los tiv thaiv lamination delamination.

Ntiaj teb no Logistics: Export mov saw infrastructure pab Circuit Court board manufacturers thoob plaws North America, Europe, thiab Asia.