Siab -Tub Kub Kho RA Copper Foil

Siab -Purity tooj liab

Cov khoom siv hauv paus yog siab -purity cathode tooj liab nrog cov ntsiab lus tooj liab ntau dua lossis sib npaug rau 99.99%, teev raws li Cu-ETP lossis Cu-OF.

Tswj Cov Qauv Ua Ntej

Multi-dhau txias dov thiab tswj- atmosphere annealing tsim ib qho qauv equiaxed grain qauv los txhawb txhua yam ruaj khov thiab rov kho dua.

Kev kho saum npoo

Kev tiv thaiv tus kheej los tiv thaiv- oxidation passivation barrier yog siv rau ntawm tooj liab. Mechanical lossis chemical roughening kuj tseem tuaj yeem raug teev rau cov ntawv thov kom muaj zog adhesion rau polyimide (PI) lossis kua siv lead ua polymer (LCP) zaj duab xis.

Siab -Qhov kub thiab txias

Cov khoom khaws cia cov neeg kho tshuab kev ncaj ncees thiab tiv thaiv oxidation nyob rau hauv siab - qhov kub thiab txias. Cov kev qhia tshwj xeeb tam sim no qhia tsis muaj qhov hloov pauv ntawm qhov chaw ntawm 300℃rau 60 feeb hauv kev ntsuas thermal -tsis kam.

Flexural Endurance

Lub equiaxed grain qauv txhawb rov dynamic dabtsi yog khoov, nrog ib tug qhia txog qaug zog lub neej tshaj 150,000 MIT folding cycles ntawm 18 μm thickness.

Peel zog

Peel lub zog tseem nyob ntawm Ntau dua lossis sib npaug ntawm 0.8 kN / m nrog PI substrates tom qab ntau cov hmoov lead -dawb reflow mus txog 260℃. Rau cov ntawv thov uas kev sib txuas ua haujlwm yog qhov tseem ceeb ntawm cov khoom siv,Siab -Peel-Lub zog RA Copper Foilkuj tuaj yeem txiav txim siab.

Dimensional Stability

Kev tswj cov kev ntxhov siab nyob hauv yuav pab txo qis curling thiab wrinkling thaum lub sij hawm tshuaj etching thiab lwm yam downstream ua.

Precision Rolling

High - precision Sendzimir mills yog siv los tswj cov thickness uniformity, nrog rau cov txheej txheem tam sim no specification tswj variation nyob rau hauv ± 3 μm thoob plaws coil widths.

Tswj Atmosphere Annealing

Nruam ci annealing yog ua nyob rau hauv hydrogen-nitrogen tiv thaiv huab cua los tswj cov tooj liab cov qauv nplej thiab qhov chaw nyob.

Kev tshuaj xyuas tsis siv neeg

100% automated optical soj ntsuam yog siv los txheeb xyuas cov pinholes, metallic inclusions, thiab ntug kab nrib pleb.

Laboratory Verification

Ntau lawm ntau dhau kev sim tensile, nto profile, thiab glow discharge mass spectrometry (GD{0}}MS) tsom xam rau cov ntaub ntawv pov thawj.

Flexible Printed Circuits

Siv rau cov pob khawm dynamic nyob rau hauv cov lus qhia foldable thiab hloov tau yooj yim rau kev kho mob sojntsuam, qhov twg rov khoov thiab thermal stability yog qhov tseem ceeb.

Hluav taws xob tsheb Electronics

Haum rau BMS saj zawg zog ca cables thiab laminated busbars siv nyob rau hauv hluav taws xob tsheb hluav taws xob tshuab.

Siab -Frequency Transmission

Siv rau 5G kav hlau txais xov modules thiab millimeter -wave kev sib txuas lus substrates yuav tsum tau tswj tooj liab ntawv ci yam ntxwv.

Semiconductor Ntim

Tsim nyog rau Chip - ntawm -Flex (COF) substrates yuav tsum tau nplua - kab etching, suav nrog cov ntawv thov nrog cov kab / qhov chaw yuav tsum tsawg dua lossis sib npaug li 15 μm.

Cov ntawv ci yog ntim los tiv thaiv cov tooj liab uas tau kho los ntawm kev ya raws, kev sib kis, thiab kev puas tsuaj thaum thauj.

• Anti- lub tshuab nqus tsev zoo li qub- cov hnab polyethylene kaw

• Silica gel desiccant

• Ncua ua npuas ncauj kawg -caps

• Fumigation -dawb ntoo export crates

• Kub- tswj cia ntawm 20℃± 5 degree

• txheeb ze av noo qis dua 60%

Cov lus qhia tshwj xeeb tau teev tseg nrog 7-10 hnub ua haujlwm thauj khoom lub sijhawm, thaum kev tsim khoom lag luam xav tau 20-25 hnub ua haujlwm.